01，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)焊(han)(han)(han)點(dian)(dian)空焊(han)(han)(han) 02，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)焊(han)(han)(han)點(dian)(dian)冷焊(han)(han)(han)：用(yong)牙簽輕(qing)撥零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)引腳(jiao),若能撥動即為(wei)(wei)(wei)(wei)冷焊(han)(han)(han) 03，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)（焊(han)(han)(han)點(dian)(dian)）短(duan)路（錫(xi)(xi)(xi)橋） 04，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)缺件(jian)(jian)(jian)(jian)(jian)(jian)(jian) 05，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)錯件(jian)(jian)(jian)(jian)(jian)(jian)(jian) 06，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)極性(xing)反或(huo)錯造成燃燒(shao)或(huo)爆炸 07，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)多件(jian)(jian)(jian)(jian)(jian)(jian)(jian) 08，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)翻件(jian)(jian)(jian)(jian)(jian)(jian)(jian)：文字面朝下 09，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)側(ce)立：片式元(yuan)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)長≤3mm,寬(kuan)≤1.5mm不超過(guo)五個(ge)（MI） 10，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)墓(mu)碑：片式元(yuan)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)末端(duan)翹(qiao)起 11，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)腳(jiao)偏移：側(ce)面偏移小(xiao)于(yu)(yu)或(huo)等于(yu)(yu)可焊(han)(han)(han)端(duan)寬(kuan)度(du)(du)的1/2 12，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)浮高(gao)：元(yuan)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)底部與基板距(ju)離(li)(li) 13，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)腳(jiao)高(gao)翹(qiao)：翹(qiao)起之(zhi)高(gao)度(du)(du)大于(yu)(yu)零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)腳(jiao)的厚度(du)(du) 14，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)腳(jiao)跟(gen)未(wei)平貼腳(jiao)跟(gen)未(wei)吃(chi)(chi)(chi)錫(xi)(xi)(xi) 15，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)無法(fa)(fa)辨(bian)識（印字模(mo)糊(hu)） 16，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)腳(jiao)或(huo)本(ben)(ben)體(ti)氧化 17，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)本(ben)(ben)體(ti)破損(sun)：電容破損(sun)(MA);電阻(zu)破損(sun)小(xiao)于(yu)(yu)元(yuan)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)寬(kuan)度(du)(du)或(huo)厚度(du)(du)的1/4(MI);IC破損(sun)之(zhi)任一方(fang)向長度(du)(du) 18，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)使用(yong)非(fei)指(zhi)(zhi)定供(gong)應商：依BOM，ECN 19，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)焊(han)(han)(han)點(dian)(dian)錫(xi)(xi)(xi)尖：錫(xi)(xi)(xi)尖高(gao)度(du)(du)大于(yu)(yu)零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)本(ben)(ben)體(ti)高(gao)度(du)(du) 20，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)吃(chi)(chi)(chi)錫(xi)(xi)(xi)過(guo)少：最小(xiao)焊(han)(han)(han)點(dian)(dian)高(gao)度(du)(du)小(xiao)于(yu)(yu)焊(han)(han)(han)錫(xi)(xi)(xi)厚度(du)(du)加可焊(han)(han)(han)端(duan)高(gao)度(du)(du)的25%或(huo)焊(han)(han)(han)錫(xi)(xi)(xi)厚度(du)(du)加0.5mm,其中較小(xiao)者為(wei)(wei)(wei)(wei)(MA) 21，SMT零(ling)(ling)(ling)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)吃(chi)(chi)(chi)錫(xi)(xi)(xi)過(guo)多：最大焊(han)(han)(han)點(dian)(dian)高(gao)度(du)(du)超出焊(han)(han)(han)盤或(huo)爬伸至金屬(shu)鍍層端(duan)帽可焊(han)(han)(han)端(duan)的頂部為(wei)(wei)(wei)(wei)允收(shou),焊(han)(han)(han)錫(xi)(xi)(xi)接(jie)觸元(yuan)件(jian)(jian)(jian)(jian)(jian)(jian)(jian)本(ben)(ben)體(ti)(MA) 22， 錫(xi)(xi)(xi)球(qiu)/錫(xi)(xi)(xi)渣：每600mm2多于(yu)(yu)5個(ge)錫(xi)(xi)(xi)球(qiu)或(huo)焊(han)(han)(han)錫(xi)(xi)(xi)潑(po)濺(0.13mm或(huo)更(geng)小(xiao))為(wei)(wei)(wei)(wei)(MA) 23， 焊(han)(han)(han)點(dian)(dian)有(you)針孔/吹孔：一個(ge)焊(han)(han)(han)點(dian)(dian)有(you)一個(ge)(含(han))以(yi)上為(wei)(wei)(wei)(wei)(MI) 24， 結晶(jing)(jing)現(xian)象(xiang) ：在PCB板表面,焊(han)(han)(han)接(jie)端(duan)子或(huo)端(duan)子周圍(wei)有(you)白(bai)色殘留(liu)物(wu),金屬(shu)表面有(you)白(bai)色結晶(jing)(jing) 25， 板面不潔 ：手臂(bei)長距(ju)離(li)(li)30秒(miao)內無法(fa)(fa)發現(xian)的不潔為(wei)(wei)(wei)(wei)允收(shou) 26， 點(dian)(dian)膠(jiao)不良 ：粘(zhan)膠(jiao)位(wei)于(yu)(yu)待焊(han)(han)(han)區域，減少待焊(han)(han)(han)端(duan)的寬(kuan)度(du)(du)超過(guo)50% 27， PCB銅(tong)箔翹(qiao)皮 28， PCB露(lu)銅(tong)：線路(金手指(zhi)(zhi))露(lu)銅(tong)寬(kuan)度(du)(du)大于(yu)(yu)0.5mm為(wei)(wei)(wei)(wei)(MA) 29， PCB刮傷：刮傷未(wei)見底材 30， PCB焦(jiao)(jiao)黃：PCB經過(guo)回焊(han)(han)(han)爐或(huo)維修后有(you)烤焦(jiao)(jiao)發黃與PCB顏色不同時(shi) 31， PCB彎(wan)曲(qu)：任一方(fang)向之(zhi)彎(wan)曲(qu)在每300mm間的變形(xing)超過(guo)1mm (300:1)為(wei)(wei)(wei)(wei)(MA) 32， PCB內層分離(li)(li)（汽泡(pao)） ：發生起泡(pao)和分層的區域不超出鍍覆孔間或(huo)內部導(dao)(dao)線間距(ju)離(li)(li)的25%(MI);在鍍覆孔間或(huo)內部導(dao)(dao)線間起泡(pao)(MA) 33， PCB沾(zhan)異(yi)物(wu)：導(dao)(dao)電者(MA);非(fei)導(dao)(dao)電者(MI) 34， PCB版本(ben)(ben)錯誤：依BOM,ECN 35， 金手指(zhi)(zhi)沾(zhan)錫(xi)(xi)(xi) ：沾(zhan)錫(xi)(xi)(xi)位(wei)置落在板邊算起80%內(MA)